Description
Infineon Eupec FZ1200R12KF1, Half-Bridge IGBT Power Module, 1200V / 1200A
Core Product Overview
FZ1200R12KF1 is a high-power half-bridge IGBT module from Infineon Eupec FZ series. It integrates two IGBT chips with anti-parallel freewheeling diodes in a single half-bridge package. It is widely used in high-power converters, medium-voltage inverters, large servo power units, traction drives and UPS systems. This is a power semiconductor switching component, commonly found inside the Rexroth TVM servo power supply and large variable frequency drives, not DCS/SIS rack card.
Main Technical Specifications
- Part Number: FZ1200R12KF1
- Manufacturer: Infineon (Eupec)
- Device Type: Half-bridge IGBT power module
- Collector-Emitter Voltage Vces: 1200 V
- Rated Collector Current Ic (Tc=80°C): 1200 A
- Internal Structure: Half-bridge (2 IGBT + 2 FWD freewheeling diodes)
- Max junction temperature Tj: 150°C
- Isolation voltage: 2500 VAC (1 min)
- Substrate: Copper baseplate, Al₂O₃ ceramic insulation
- Gate drive: Standard IGBT +15V / -15V gate signal
- Package: IH1 high-power press-fit screw terminal module
- Status: Obsolete legacy Eupec generation; available as new surplus or tested refurbished spare
- Typical matching: High-power inverter / servo power unit, can be used in TVM series Rexroth power supply rebuild

FZ1200R12KF1
Same-Series Model Recommendations (8 Models)
- FZ1200R12KF1 (subject model)
- FZ1200R12KF5 (updated 1200V 1200A half-bridge variant)
- FZ1000R12KF1 (1000A /1200A half-bridge)
- FZ800R12KF1 (800A /1200V)
- TVM2.4-050-220/300-W1 Rexroth servo power supply
- 2AD160B-B350R2-BS03-D2N1 Rexroth servo motor
- CC-IP0101 Honeywell PROFIBUS gateway
- FC-QPP-0001 Honeywell Safety Manager SIS CPU
Professional Quality Control & Testing Standard Operating Procedures
All surplus and refurbished FZ1200R12KF1 IGBT modules follow this inspection workflow:
- Visual Inspection: Check baseplate, screw terminals, silicone seal, label, no crack or delamination.
- Diode / IGBT Static Test: Measure Vce(sat), forward diode drop, gate leakage, confirm no short between C-E, G-E.
- Isolation Megger Test: Hi-pot test between power terminals and copper baseplate, pass 2500VAC isolation.
- Gate Characteristic Test: Verify gate threshold Vge(th), check gate charge.
- Double Pulse Switching Test: Test turn-on / turn-off waveform, check for noise or tail current anomaly.
- Thermal Resistance Test: Measure Rth(j-c) with pulsed load.
- Load Cycle Screening: Intermittent power cycling to detect internal die bond weakness.
- Final Cleaning & Packaging: Torque terminal threads, apply thermal grease protective film, ESD packaging with test report.
New / Refurbished Module Installation Guidelines
- Pre-Installation Safety: Lock out main AC power, fully discharge DC bus capacitors, wear ESD wrist strap.
- Heatsink Preparation: Flatness inspection, clean old thermal compound, apply uniform thin layer of thermal grease.
- Mounting Torque: Follow datasheet torque spec for mounting screws and power terminals; uneven torque causes thermal runaway.
- Gate Wiring: Use twisted shielded gate wire, short trace length, separate high-current power cables from gate signals.
- Gate Drive Configuration: Set +15V / -15V gate supply, add gate resistor matched to module switching speed.
- Offline Static Test: Before power-up, recheck for short circuit with multimeter.
- Commissioning & Acceptance: Low-voltage incremental power-up, monitor Vce and temperature under load, set overcurrent / short-circuit protection.
Application Scenarios & Product Features
Typical Application Scenarios
- Large industrial inverters and medium power converters
- Rexroth Indramat high-power TVM servo power supply repair / rebuild
- Traction auxiliary converters, large UPS and battery test equipment
- Spare replacement for legacy high-power Eupec converter stacks
Core Product Features
- Half-bridge topology, high current density 1200A@1200V
- Integrated freewheeling diodes for inductive load energy return
- Copper baseplate for high thermal conductivity, suitable for liquid or forced air cooling
- Screw power terminals for heavy busbar connection
- Requires isolated gate driver; must implement short-circuit protection
- Legacy Eupec chipset, not recommended for new design, only for maintenance spare
Frequently Asked Questions (FAQ)
Q1: What does FZ1200R12KF1 stand for? A1: FZ = Eupec half-bridge series; 1200 = 1200A rated; R12 = 1200V Vces; KF1 = specific chip generation and package code.
A2: Pinout and mechanical footprint are the same, but switching parameters differ; gate resistance and protection threshold need re-validation.
Q3: Can it work without gate drive negative voltage? A3: Not recommended. Negative -15V gate bias is required to prevent false turn-on under high dv/dt.
Q4: What are common failure modes? A4: Short circuit IGBT die rupture, bond wire lift-off from thermal cycling, gate oxide breakdown, isolation creepage failure, baseplate delamination.
Q5: Is this a Honeywell or Yokogawa DCS module? A5: No, it is a power semiconductor IGBT module used inside drives and power supplies, unrelated to process control rack hardware.


