Name: MKS RPS AX7695 R*evolution® III Integrated Remote Plasma Source - MASSIVE
Brand: Other

Description

MKS RPS AX7695 R*evolution® III Integrated Remote Plasma Source

Product Description

The MKS RPS AX7695 is a compact, fully integrated remote plasma source built for advanced semiconductor and thin-film manufacturing. It combines a toroidal quartz plasma chamber, 13.56 MHz RF power supply, matching network, and control electronics within a single sealed unit. Instead of generating plasma directly inside the process chamber, this remote source creates high-purity atomic radicals remotely and delivers neutral reactive species to the wafer. This design minimizes ion bombardment and substrate damage, supporting low-damage photoresist stripping, wafer pre-cleaning, oxidation, and nitridation processes. Featuring patented low-field toroidal plasma technology, it delivers high radical flux with exceptional process repeatability and stable radical uniformity. The unit supports continuous 100% duty-cycle operation and includes built-in thermal and cooling interlocks to protect critical components in high-throughput fab environments. It is a key OEM spare for maintenance of semiconductor process tools.

RPS AX7695

Technical Specifications

Item	Parameter
Model	RPS AX7695
Brand	MKS
Product Family	R*evolution® III Remote Plasma Source
RF Frequency	13.56 MHz, ISM band
Maximum RF Power	6 kW
Process Gas Flow	Up to 6.0 slm (O₂ or 90% O₂ /10% N₂)
Ignition Gas	O₂, Ar, or 90% O₂/10% N₂
Operating Pressure	0.5 – 2.0 Torr measured at outlet, 1.0–6.0 slm
Electrical Input	180–228 VAC, 3-phase, 50/60 Hz
Cooling Requirement	Water cooling, 1.75 gpm, inlet <30°C
Duty Cycle	100% continuous operation
Wetted Materials	6061-T6 Al, 316L SS, SiO₂, Kalrez®, nickel, fluorosilicone
Control Interface	Discrete I/O, RS‑232, DeviceNet, Ethernet (TOOLweb® compatible)
Interlocks	Thermal shutdown, cooling water flow interlock
Mounting	Direct flange mount to process chamber

Compatibility & Installation Traps

Compatibility

Designed for integration with compatible semiconductor process chambers and MKS tool control platforms.
Requires matched host tool recipe software and communication driver for DeviceNet/Ethernet control.
Gas delivery lines must be rated for ultra-high-purity (UHP) service and compatible with oxidizing radicals.
Not interchangeable with older R*evolution II plasma sources even with similar footprint; RF tuning, interlock logic and gas manifold pinout differ.

Common Installation Traps

Improper cooling water flow or excessive inlet temperature triggers immediate interlock shutdown and can crack the quartz plasma chamber.
Using non-UHP tubing or incompatible elastomers for radical delivery; radical species degrade unsuitable materials and introduce particle contamination.
Misalignment of the flange seal at the process chamber interface causes vacuum leaks, unstable ignition and poor radical transport.
Incorrect three-phase AC wiring sequence; phase reversal leads to fan rotation fault and power supply lockout.
Igniting plasma outside the specified pressure window; out-of-range pressure results in failed strike or unstable plasma density.
Bypassing factory safety interlocks for troubleshooting; this removes over-temperature and low-flow protection and risks catastrophic quartz failure.
Hot swapping the unit while RF and process gas are active; residual RF energy and pressurized gas can cause arc hazards and component damage.
Mismatched recipe power setpoints after replacement; new unit requires RF tuning and radical rate validation before production wafers run.

Standard Operating Procedure (SOP)

Pre-inspection: Inspect AX7695 for quartz cracks, flange damage, water fitting corrosion and connector wear. Confirm part number and revision match the original source.
Isolation and lockout: Secure tool EMO, shut down three-phase mains, isolate UHP gas supply and cooling water. Vent the plasma source and verify zero energy state.
ESD and PPE preparation: Wear ESD protection, heat-resistant gloves and face shield for plasma source handling.
Disassembly: Mark gas, cooling, signal and power connectors. Release vacuum flange fasteners and carefully separate the source from the process chamber.
Mount replacement unit: Install new AX7695 with new gasket/face seal, torque flange bolts in cross pattern per OEM torque specification.
Reconnect utilities: Restore cooling water, UHP gas lines, discrete I/O and communication cables; verify flow direction and leak-check all vacuum and water joints.
Power and communication checkout: Restore AC power, enable tool communication and confirm the controller recognizes the source.
Plasma ignition and tuning: Run dry ignition test, perform RF match tuning, validate interlock response and measure radical flux or strip rate with monitor wafers.
Final release: Save tuned recipe parameters, clear fault logs, run particle and qualification tests, and return the tool to production status.